• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for contacting and fastening of ceramic pressure sensors (2) on a printed circuit board (1), wherein the pressure sensor on an outer side a plurality of spaced apart contact surfaces and these contact surfaces with corresponding contact surfaces (7) are connected to the circuit board. In order to replace the manual attachment of the pressure sensor to the circuit board, it is provided that the pressure sensor (2) has a position identification (9), the printed circuit board (1) automatically coated by means of stencil or printing process with a conductive layer for material connection and the pressure sensor (2) by means of a placement machine on the circuit board (1) set and the cohesive connection is made.
    公开号:AT515070A1
    申请号:T50708/2013
    申请日:2013-10-30
    公开日:2015-05-15
    发明作者:Leopold Ing Hellinger；Gerhard Ing Neumann
    申请人:Melecs Ews Gmbh & Co Kg；
    IPC主号:
    专利说明:

    description
    Method for contacting and fixing ceramic pressure sensors on a printed circuit board
    Technical area
    The invention relates to a method of contacting and mounting ceramic pressure sensors on a printed circuit board, the pressure sensor having a plurality of spaced-apart contact surfaces on an outside thereof, and connecting these contact surfaces to corresponding contact surfaces on the circuit board.
    A printed circuit board (PCB) is a carrier for electronic components. It is used for mechanical fastening and electrical connection. Circuit boards are made of electrically insulating material with conductive interconnects (traces) adhered thereto. Fiber-reinforced plastic is common as insulating material, but the printed circuit board could also be made of ceramic or contain one or more ceramic or metal layers.
    The tracks are etched from a thin conductive layer (mostly copper). The layer thickness is typically 35 pm and for applications with higher currents between 70 pm and 140 pm. In order to make thinner printed conductors possible, printed circuit boards with only 18 μm conductive layers are also produced. The devices are soldered to pads (solder pads, pads) or pads that are also etched from the thin conductive layer. By soldering the components are connected to the circuit board, so mechanically fixed to the printed circuit board at the same time and electrically contacted.
    In particular, ceramic pressure sensors (= ceramic measuring cells, = piezoresistive ceramic sensors) with the
    Substrate electrically and mechanically connected. These pressure sensors are used in industry and automotive for pressure measurement of gaseous media.
    State of the art
    The ceramic pressure sensors are usually of a standard diameter, e.g. of 18 mm, and have an outwardly substantially cylindrical shape, the diameter usually being greater than the height of the cylinder. On one end face of the cylinder (the underside), the very thin measuring membrane is attached, on which usually a resistance bridge, components for temperature compensation and several, usually four, so-called connection pads, so contact surfaces, automatically as thin layers, such as silk screen applied. The pads thus fabricated, like the conductive pads on the printed circuit board, have a thickness of 10-140 ym.
    Heretofore, the connection pads have been used by various methods, e.g. applied by soldering or bonding, contacts. These usually have a thickness which is substantially greater than the thickness of the contact surfaces. For these contacts, recordings had to be made on the circuit board, ie holes (for through-mounting) or solder pads (= contact surfaces, for surface mounting). Finally, the ceramic pressure sensors were usually applied by hand to the printed circuit board and fastened, e.g. by wave soldering or bonding (gluing).
    The manual attachment of the ceramic pressure sensors is laborious and allows only low throughput rates.
    Presentation of the invention
    It is therefore an object of the present invention to provide a method by which the attachment of the ceramic pressure sensors can be automated.
    This object is achieved by a method having the features of claim 1 in that the pressure sensor has a positional marking, the printed circuit board is automatically coated by means of stencils with a conductive, liquid-like or pasty layer for adhesive bonding and the pressure sensor is placed on the printed circuit board by means of a placement machine and the material fit Connection is made.
    It thus eliminates the hitherto customary process step, in which are applied to the contact surfaces of the pressure sensor manual contacts. Instead, the pressure sensor is only placed with the contact surfaces on the connection points produced by means of a template (or printing method), whereby the placement machine adjusts the orientation of the pressure sensor based on the position identification. The conductive layer may then be solder paste and the placement machine places the pressure sensor on the solder joints made by stencil (or printing process). Dielectric layer could also be a conductive adhesive, which usually has a higher elasticity than solder paste.
    The location tag is best readable by an optical camera for the orientation of the pressure sensor.
    After assembly, the cohesive connection is made as usual. For example, a solder joint is strengthened, such as by heating the board in an oven again, so that the solder wets the pads, and then cooled. Likewise, a glue for curing can be heated.
    A positional marking, which can be detected well with a camera of the placement machine, which serves for the position-oriented assembly, can be formed from one or more notches on the circumference of the pressure sensor.
    The registration can also be formed by a colored dot, since often several notches are arranged symmetrically and thus not always given a unique position information on the basis of notches.
    The outside of the pressure sensor, where the contact surfaces are arranged, may be the end face of a cylindrical pressure sensor and the contact surfaces of the pressure sensor may be in the form of segments of a annulus located near the sensor periphery. By having contact pads distributed across the circumference of the sensor, it is ensured that the force introduced into the sensor by the pressure to be measured is transmitted evenly across the printed circuit board into the support of the printed circuit board.
    Because the pressure sensor and printed circuit board typically have a different thermal expansion, the printed circuit board may include one or more expansion slots at least partially disposed about the contact surfaces for the pressure sensor. For each contact surface of the printed circuit board, which has the shape of a circular ring segment, there may be provided, for example, an expansion slot in the form of a circular ring segment coaxial with the contact surface and radially outward of the contact surface, which is radially connected to the central recess for the pressure sensor. In this case, the expansion slot can be connected at one end of the annulus segment with the central recess for the pressure sensor. Or the expansion slot may be connected in the center of the annulus segment to the central recess for the pressure sensor.
    Radially outside the expansion slot (s) around the contact surfaces, further expansion slots may be provided in the circuit board. These may e.g. also have the form of circular ring segments, which are arranged concentrically zuzentralen recess for the pressure sensor.
    Generally, the expansion slots are designed as relief milled holes that completely penetrate the printed circuit board in the thickness direction.
    The invention also includes a printed circuit board having a ceramic pressure sensor (or also a plurality of ceramic pressure sensors) produced by the method according to the invention, wherein the pressure sensor has a plurality of mutually spaced contact surfaces on one outer side and these contact surfaces are materially connected to corresponding contact surfaces on the printed circuit board by means of a conductive layer. It is provided that the pressure sensor has a position identification and the circuit board has at least one expansion slot which is at least partially disposed around the contact surfaces for the pressure sensor.
    The design of the expansion slots has already been described in connection with the method according to the invention.
    The number of connections (eg, solder joints) between the pressure sensor and the circuit board is halved, assuming that in the conventional method, per contact surface, a connection line had to be soldered to both the pressure sensor and the circuit board , so there were two solder joints. In the method according to the invention, a contact surface of the pressure sensor is soldered directly onto a contact surface of the printed circuit board, there is only one solder joint.
    Brief description of the figures
    To further explain the invention, reference is made in the following part of the description to the figures, from which further advantageous embodiments, details and further developments of the invention are to be taken. Show it:
    1 is a plan view of a first variant of a printed circuit board according to the invention,
    Fig. 2 is a perspective view of the circuit board of FIG. 1 facing the associated pressure sensor from below,
    3 is a perspective view of the printed circuit board of FIG. 1 looking at the associated pressure sensor from above,
    4 is a perspective view of the printed circuit board of FIG. 1 with attached pressure sensor,
    5 shows a plan view of a second variant of a circuit board prepared according to the invention,
    Fig. 6 is a perspective view of the circuit board of FIG. 5 looking at the associated pressure sensor from below,
    7 is a perspective view of the printed circuit board of FIG. 5 looking at the associated pressure sensor from above,
    Fig. 8 is a perspective view of the printed circuit board of Fig. 5 with attached pressure sensor.
    Embodiment of the invention
    Fig. 1 shows a section of a circuit board 1 with recesses for a pressure sensor 2, which is shown in Figs. 2-4: the recesses comprise a central -hier circular - recess 3 for pressure sensor and four expansion slots 4, which emanate from the central recess 3. The diameter of the central recess 3 is at most as large (especially the same size) as the
    Diameter of that area of the end face 5 of the pressure sensor 2, which lies within the contact surfaces 6 of the pressure sensor. The central recess 3 completely penetrates the circuit board 1.
    The expansion slots 4 are each partially passed around the contact surfaces 7 of the printed circuit board 1 for the pressure sensor 2. The contact surfaces 7 are designed as segments of circular rings rounded at their ends, which are approximately one eighth to one tenth of the circumference of the circumference. The contact surfaces 7 are designed concentrically to the central recess 3. Each contact surface 7 has, radially outwardly, an expansion slot 4 in the form of a circular ring segment coaxial with the contact surface 7. The annular segment of the expansion slot 4 is longer than the associated contact surface 7, protruding in the circumferential direction at one end over the contact surface 7. The other end of the annulus segment of the expansion slot 4 merges into a straight slot radially connected to the central recess 3 for the pressure sensor 2. The expansion slots 4 thus emanate outwardly - similarly angled beams - from the central recess 3.
    Through the expansion slots 4, each contact surface 7 is at the free end of an arm 8, which - as viewed in the radial direction - is bounded inside by the central recess 3, on both sides by a respective expansion slot 4 and on the outside by an expansion slot 7. This arm 8 can be at the free Move the end slightly in or out and swing normal to the PCB 1. As seen in the circumferential direction, the connection of this arm 8 with the rest of the printed circuit board 1 is of the same order of magnitude as the length of the contact surface 7, here the connection is somewhat shorter than the contact surface 7.
    Fig. 2 shows printed circuit board 1 with the associated pressure sensor 2, of which here the underside (end face 5) can be seen.
    The pressure sensor 2 is implemented as a ceramic hollow cylinder, in which example the thickness of the cylinder wall corresponds to about half of the outer radius of the cylinder, see Fig. 3. The end face 5 is formed by a -highly circular plate carrying at least the four contact surfaces 6, which approximately produced by screen printing. In addition, a resistance measuring bridge and / or components for temperature compensation may be mounted on the underside 9.
    The contact surfaces 6 are designed as segments of circular rings rounded off at their ends, which are approximately one-eighth to one-tenth of the circumference of the pressure sensor 2, respectively. The contact surfaces 6 are designed concentrically with the cylindrical circumference of the pressure sensor 2. Their shape, size and mutual arrangement correspond to those of the contact surfaces 7 on the printed circuit board 1.
    During assembly, the pressure sensor 2 is placed with its end face 5 and the contact surfaces 6 thereon on the corresponding contact surfaces 7 on the printed circuit board 1. The contact surfaces 7 were previously automated with solder paste. For mutual alignment of the contact surfaces 6, 7, the ceramic body of the pressure sensor 2 has on its peripheral surface four axially extending notches 9 for positional marking. These runs here over the entire height of the ceramic body and are also recognizable on the end faces 5. The notches 9 are arranged at equal intervals in the circumferential direction.
    4 shows printed circuit board 1 with attached pressure sensor 2. Of the recesses in printed circuit board 1 for the pressure sensor, only the four expansion slots 4 are visible.
    Fig. 5 shows a second embodiment of the invention. This is shown by means of a section of a printed circuit board 1 with recesses for a pressure sensor 2, which is shown in FIGS. 6-8: the recesses again comprise a central - here circular - recess 3 for pressure sensors, as well as four expansion slots 4, which emanate from the central recess 3 , The diameter of the central recess 3 is at most as large as the diameter of that region of the end face 5 of the pressure sensor 2 which lies within the contact surfaces 6 of the pressure sensor. The central recess 3 completely penetrates the circuit board 1.
    The expansion slots 4 are each partially passed around the contact surfaces 7 of the printed circuit board 1 for the pressure sensor 2. The contact surfaces 7 are designed as segments of circular rings rounded at their ends, which are approximately one-eighth to one-tenth of the circumference, respectively, and thus correspond to those of Fig. 1, since they are to be suitable for the same pressure sensor 2. The contact surfaces 7 are consequently again designed concentrically to the central recess 3.
    Each two adjacent contact surfaces 7 have radially outwardly a common expansion slot 4 in the form of a circular ring segment, which is arranged coaxially with the contact surfaces 7. The annular segment of the expansion slot 4 is, in particular two to three times, longer than an associated contact surface 7, it protrudes in the circumferential direction with its two ends respectively over at least the end of a contact surface 7. The expansion slot 4 is not sufficient to the center of the contact surface 7, because he otherwise would go into the next expansion slot 4.
    In the middle of the circular ring segment of the expansion slot 4, this merges into a straight slot, which is connected radially to the central recess 3 for the pressure sensor 2.
    Through the expansion slots 4, each contact surface 7 is at the free end of an arm 8, which - seen in the radial direction - inside through the central
    Recess 3 is limited and on both sides and outside through two expansion slots 7. This arm 8 can move slightly amrei free inward or outward as well as swing normalzur PCB 1. In the circumferential direction, the connection of this arm 8 with the remaining printed circuit board 1 is smaller than the length of a contact surface 7.
    Radially outside of the expansion slots 4, four further expansion slots 11 are provided in the printed circuit board 1, which also have the shape of circular ring segments and represent a continuous opening through the printed circuit board 1. They are concentric with the central recess 3 and the expansion slots 4. They occupy a little more than a quarter of the circumference each time. They cover - seen in the radial direction - the area between two expansion slots 4 and the area of the contact surface 7. The other expansion slots 11 are the same distance from each other.
    Fig. 6 shows - analogous to Fig. 2 - the printed circuit board 1 with the associated pressure sensor 2, of which here the underside (end face 5) can be seen. The pressure sensor 2 is the same as that of Figs. 2-4 executed. Fig. 7 shows the pressure sensor 2 analogous to Fig. 3 with the bottom (end face 5) already rotated in the direction of the circuit board 1.
    During assembly, the pressure sensor 2 is placed with its end face 5 and the contact surfaces 6 thereon on the corresponding contact surfaces 7 on the printed circuit board 1. The contact surfaces 7 were previously automated with solder paste. For mutual alignment of the contact surfaces 6, 7 has the ceramic body of the pressure sensor 2 on its peripheral surface also here four notches 9 extending in axial direction for position identification.
    Fig. 8 shows the circuit board 1 with attached pressure sensor 2. From the recesses in the circuit board 1 for the
    Pressure sensor, only the four expansion slots 4 and the other expansion slots 11 can be seen.
    As the circuit board 1, in all applications, a circuit board made of the base material FR4 consisting of epoxy resin as a matrix and glass fiber fabric as a reinforcement can be used. This base material is particularly cost-effective.
    Reference symbol list: 1 printed circuit board 2 pressure sensor 3 central recess for pressure sensor 4 expansion slot 5 end face of pressure sensor 2 6 contact surface of pressure sensor 2 7 contact surface of printed circuit board 1 2 8 arm of contact surface 7 9 notch (position marking) 10 resistance measuring bridge 11 further expansion slot
    权利要求:
    Claims (15)
    [1]
    1. A method for contacting and fixing of ceramic pressure sensors (2) on a printed circuit board (1), wherein the pressure sensor on an outer side of a plurality of spaced apart contact surfaces (6) and these contact surfaces with corresponding contact surfaces (7) are connected to the circuit board, characterized in that the pressure sensor (2) has a positional marking (9), the printed circuit board (1) is automatically coated with a conductive layer for material bonding by means of stenciling or printing processes and the pressure sensor (2) is placed on the printed circuit board (1) by means of a placement machine and the cohesive connection is established.
    [2]
    A method according to claim 1, characterized in that the conductive layer for cohesive bonding is solder paste or conductive adhesive.
    [3]
    Method according to claim 1 or 2, characterized in that the positional marking (9) is formed by one or more notches on the circumference of the pressure sensor (2).
    [4]
    4. The method according to claim 1 or 2, characterized in that the position identification is formed by a color point.
    [5]
    A method according to any one of claims 1 to 4, characterized in that the outside of the pressure sensor is the end face (5) of a cylindrical pressure sensor (2) and the contact surfaces (6) of the pressure sensor are in the form of segments of a circular ring located close to the sensor periphery.
    [6]
    A method according to any one of claims 1 to 5, characterized in that the printed circuit board (1) has one or more expansion slots (4) arranged at least partially around the contact surfaces (7) for the pressure sensor.
    [7]
    A method according to claim 6, characterized in that for each contact surface (7) of the printed circuit board (1) having the shape of a circular segment, an expansion slot (4) in the form of a circular segment is provided coaxial with the contact surface (7) and radially outside the contact surface (7) which is radially connected to the central recess (3) for the pressure sensor (2).
    [8]
    A method according to claim 7, characterized in that the expansion slot (4) at one end of the annulus segment is connected to the central recess (3) for the pressure sensor.
    [9]
    A method according to claim 7, characterized in that the expansion slot (4) in the middle of the circular ring segment is connected to the central recess (3) for the pressure sensor.
    [10]
    A method according to any one of claims 6 to 9, characterized in that further expansion slots (11) are provided radially outside the expansion slot or slots (4) in the printed circuit board (1).
    [11]
    11. printed circuit board (1) with ceramic pressure sensor (2), wherein the pressure sensor on an outer side a plurality of spaced apart contact surfaces (6) and these contact surfaces with corresponding contact surfaces (7) on the printed circuit board (1) are connected by means of a conductive laminate, characterized in that the Pressure sensor (2) via a position identification (9) and the printed circuit board (1) has at least one expansion slot (4) which is at least partially disposed around the contact surfaces (7) for the pressure sensor around.
    [12]
    The printed circuit board according to claim 11, characterized in that the outside of the pressure sensor is the end face (5) of a cylindrical pressure sensor (2) and the contact surfaces (6) of the pressure sensor are in the form of segments of a circular ring located close to the sensor periphery, and - that for each contact surface (7) of the printed circuit board (1), which has the shape of a circular segment, an expansion slot (4) in the form of a circular segment is provided coaxially with the contact surface (7) and radially outside the contact surface (7) radially with the central recess (3) connected to the pressure sensor.
    [13]
    The ceramic pressure sensor circuit board according to claim 12, characterized in that the expansion slot (4) is connected at one end of the annulus segment to the central recess (3) for the pressure sensor.
    [14]
    14. Printed ceramic printed circuit board according to claim 12, characterized in that the expansion slot (4) in the center of the annulus segment is connected to the central recess (3) for the pressure sensor.
    [15]
    15. Printed circuit board with ceramic pressure sensor according to one of claims 12 to 14, characterized in that radially outside the or the expansion slots (4) in the printed circuit board (1) further expansion slots (11) are provided.
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    引用文献:
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50708/2013A|AT515070B1|2013-10-30|2013-10-30|Method for contacting and fastening ceramic pressure sensors on a printed circuit board|ATA50708/2013A| AT515070B1|2013-10-30|2013-10-30|Method for contacting and fastening ceramic pressure sensors on a printed circuit board|
    EP14795567.8A| EP3064046A1|2013-10-30|2014-10-21|Method for making contact with and fastening ceramic pressure sensors on a printed circuit board|
    PCT/EP2014/072502| WO2015062908A1|2013-10-30|2014-10-21|Method for making contact with and fastening ceramic pressure sensors on a printed circuit board|
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